진학프로석·박사 채용 접수 플랫폼

Background

As demand for higher memory density grows, 3D memory technologies—such as 3D NAND and 3D DRAM—are becoming increasingly important. In parallel, hybrid bonding is emerging as a key enabler for high-density vertical interconnects in both memory and logic applications. These technologies require precise etching of high aspect ratio structures with tight profile control and minimal damage.

Dry etch processes are critical for forming deep vias, trenches, and vertical channels in 3D architectures. Challenges include maintaining uniformity in narrow features and integrating diverse materials.

The Etch group is seeking an R&D engineer to develop advanced dry etch processes for 3D integration, including 3D memory and logic. The role involves close collaboration with integration and metrology teams to support future technology nodes.

What you will do

As an R&D Etch Process Engineer, you will develop advanced dry etch solutions using imec’s state-of-the-art 300 mm pilot line and characterization infrastructure. You will play a key role in understanding and optimizing the interaction between etch processes and complex 3D integration schemes.

Your responsibilities include:

• Designing, executing, and analyzing experiments to develop novel etch processes.
• Driving joint development programs with external partners, focusing on new tool sets, materials, and metrology methodologies.
• Collaborating cross-functionally with integration, process support, hardware teams, and industrial stakeholders.
• Communicating results through internal reviews, partner updates, and scientific publications.
• Monitoring industry trends and translating insights into imec’s research roadmap.
• Interfacing with device and integration engineers to anticipate future process needs.
• Coordinating non-standard process work within imec’s 300 mm fab, ensuring smooth transfer to operational teams.